Japanese automaker Toyota, Mazda, and major auto parts supplier Denso announced on the 28th that they have signed a joint agreement to develop electric vehicle (EV) technologies. The three companies plan to establish a new company focused on advancing EV-related innovations. Let’s dive into the details with our automotive electronics editor.
In a joint statement released on the same day, the companies revealed that Toyota, Mazda, and Denso will contribute a total of 10 million yen to the new venture, with Toyota taking the largest share at 90%, while Mazda and Denso each contribute 5%. The new company will be based in Nagoya, near Toyota's headquarters, and will focus on researching and developing foundational technologies for electric vehicles across all models and levels. Full-time engineers will primarily come from the three parent companies through secondment.
With global pressure increasing to reduce greenhouse gas emissions, many countries are implementing stricter regulations, including mandates requiring a certain percentage of electric vehicles in the market. This shift is pushing automakers to accelerate their transition toward electrification.
Toyota has traditionally focused on hybrid and fuel cell technologies as part of its eco-friendly strategy. However, in November 2016, the company announced plans to build a mass production system for pure electric vehicles by 2020. More recently, in August, Toyota and Mazda entered a capital partnership to speed up their joint efforts in electric vehicle development.
This collaboration between Toyota, Mazda, and Denso not only leverages the strengths of each company but also enhances their overall competitiveness in the EV sector. By pooling resources, they can avoid the high costs associated with independent R&D, making the process more efficient and cost-effective.
As the automotive industry continues to evolve, such strategic partnerships are becoming increasingly important. This move highlights the growing importance of electric mobility and the need for collaborative innovation.
Stay tuned for more updates on automotive technology and electric vehicle developments. Our team will keep you informed with comprehensive, timely, and detailed insights.
Semiconductor Chip Carrier
Semiconductor Chip Carrier can be divided into thermo-electric modules, and the power electronic substrates.
Thermo-electric modules are plate-like semiconductor cooling devices that work by using the movement of heat when a current flows through the junction of two different metals. Compact, lightweight, and Freon-free, they are used in climate control seats of automobiles, cooling chillers, optical communications, biotechnology, air conditionners, dryers and a variety of consumer electronic products.
Application of Thermo-electric module Manufacturing Technology for Heat Dissipation and Insulation Substrate
Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers.
However, alumina, aluminum nitride and silicon nitride substrates are used in heat radiation insulated substrates of power modules that handle high power.
In particular, silicon nitride substrates are attracting attention for use in power modules of inverters and converters because of the increase in sales of HEVs and EVs.
Chip Carrier Package,Ceramic Chip Carrier,Plastic Leaded Chip Carrier,Chip Carrier Socket
SHAOXING HUALI ELECTRONICS CO., LTD. , https://www.cnsxhuali.com