The first Qipai8 package developed by the Chinese people

The package Qipai8 is the first package that was invented by the Chinese. It is the first product of the style series produced by China's packaging and manufacturing companies after more than two years of market research, technical demonstration, and formal production preparation. Following the development of Qipai8, Qipai16 has also been successfully developed. Qipai series of other products such as Qipai12, Qipai20, Qipai28 and so on will also be introduced in accordance with market demand.

Shenzhen Style Technology Co., Ltd. is an IC packaging and testing company based in Longgang, Shenzhen. It is a rapidly rising new army in the domestic packaging industry in recent years, with a total investment of more than 300 million yuan. The monthly packaging capacity exceeds 300 million integrated circuits, and it already has 32 different package formats of PDIP, HDIP, Qipai, SOP, ESOP, SSOP, TSSOP, SOT and TO series. In November 2011, it passed the certification of a state-level happy technology company. At present, Style Technology has obtained 11 national patents.

Industry insiders believe that the successful development of Qipai8 will have a significant impact on the DIP package of integrated circuits. Since the Qipai series also has the advantages of the DIP series and the SOP series, it will likely replace most of the DIP series packages in the near future.

Qipai8's appearance characteristics:

Qipai8 can also be called the style 8, other products of the series are also the same, both can be called. If you look at the appearance from the image, Qipai8 and DIP8 are almost the same. But if you put them together, the difference between the two is clear. Simply put, Qipai8 is a shrinking DIP8, and Qipai8 is only one-third the size of DIP8. The figure below is a comparison chart of the dimensions of Qipai8/DIP8/SOP8.



Qipai8's technical advantages:

The DIP series encapsulation form, when the feature size of the wafer fabrication is several micrometers in size, at present, the feature size of the wafer fabrication has been reduced by hundreds of times. However, since the 1960s and 1970s, the appearance and size of the DIP8 have not changed a lot. Although a large number of packages have been derived from it, the DIP series itself has maintained the same appearance and size for decades. However, with the advancement of semiconductor wafer fabrication technology, the feature sizes of manufactured ICs have become smaller and smaller, so that the chip area has also become smaller and smaller. From the perspective of the terminal application, the miniaturization of the terminal products also requires that the size of the device be reduced as much as possible. This requires the IC packaging industry to find new content that suits technological change. Part of the reason for the large number of new forms of application is to solve this problem. However, for decades, no one has tried to revolutionize the DIP series itself so that it can adapt to the new technological environment.

The Qipai series is based on the consideration of the above issues and the results of comprehensive consideration of various factors.

Qipai8's performance advantages:

In terms of device performance, compared to the DIP8 package, due to its compact structure, the wiring inside the IC is shortened and the structure is perfect, reducing the resistance and thermal resistance, which helps reduce the harmful heat and power consumption of the device and the whole device. Improve thermal performance, extend IC life, improve IC electrical performance and reliability, and improve overall machine life and performance.

It can also reduce unnecessary parasitic parameters formed between the leads and the leads, improving IC performance, such as reducing noise interference, enhancing signal stability, frequency characteristics, transmission speed, and the like.

Qipai8's resource saving advantages:

Due to the shrinkage of the package body, the benefits of miniaturization can be enjoyed in the entire chain of ICs from manufacturing to application.

From the perspective of IC packaging, due to the reduced size, the same size leadframe can contain more ICs, thus saving the use of materials. At the same time, no matter in the aspects of loading, bonding, plastic sealing, electroplating, cutting and tendons, etc., due to miniaturization, the consumption of unit consumables or energy consumption will be reduced and the production efficiency will be improved.

After the IC is made, it will make the welding more efficient, save a lot of solder and electricity, and also save the resources needed for labor and transportation. Since the QIP8 packaged products can be processed by wave soldering, it is possible to avoid the disadvantages that the moisture inside the mounted components will generate sufficient steam pressure to damage or damage the components when the reflow soldering technology is used, and thus has considerable flexibility. In addition to welding, to produce the final product, we have to go through multiple processes. Each process can benefit from the thinness of the product.

From the application perspective, due to the small size of the product, the overall size of the product will be reduced, and the weight of the entire machine will be reduced, thereby saving the use of materials and power consumption of the entire machine, and also saving the resources required for labor and transportation.

Due to the above-mentioned resource savings, considerable cost savings and benefits can be brought to the entire industry chain and users of ICs from the production of IC raw materials to the production of ICs to the production of complete machines to end users such as mobile phones, televisions, and networks. .

Qipai8's reliability:

So, what is the reliability of the Qipai series of packaged products? This is also the most concerned issue of Shenzhen Style Technology Co., Ltd. Before the launch of the project, the style school united with famous universities in China and asked the colleges and universities to make in-depth theoretical research. The results of theoretical research showed that the products of the style series package can pass the reliability assessment. After Qipai8's samples were successfully developed, StyleTech made a variety of reliability tests. The test results showed that Qipai8 products passed stringent reliability test requirements.



Application of Qipai8:

At present, the product has been applied in some manufacturers, and the welding process is also very smooth. Whether it is saving raw materials, saving energy, resource consumption in the production process, performance and reliability of the device itself, performance and reliability of electronic products, or production convenience, etc. The following table shows some of the products that have been used by Qipai8.



Qipai8 has been applied to the meaning of some products Qipai8:

Since the semiconductor industry, all semiconductor packages have been invented by foreign companies. Chinese companies have only passively followed other people and adopted other people's standards. The invention of Qipai series, for the first time, it is possible for Chinese companies to establish a new form of packaging, and may become the industry standard. So from this point of view, the importance of Qipai8 cannot be overstated. Since the DIP series has long been accustomed to and no one has asked questions, Style Technology has been able to innovate from the habitual thinking that is not strange, and has emerged from a path that no one has ever traveled before. The spirit of exploration is indeed worth appreciating. .

Qipai8's patent protection:

In order to launch Qipai8, StyleTech spent more than two years and spent more than 10 million yuan on investment. The company began to demonstrate the feasibility of the next step, that is, the feasibility of the welding process, with a smaller package size, and gradually began. The selection of the specific data of the package size and the pre-argumentation of the reliability performance of the product. After the demonstration is completed, preparations for production elements of the series are started, such as dedicated machines, dedicated lead frames, special materials, and so on. For this hard-earned research and production achievement, style technology is naturally very cherished. At present, it has obtained national patents. According to the national patent law, after the grant of a patent right, the invention may not be commercially manufactured, used, promised for sale, sold or imported without the consent of the patentee. Style Technology will protect its patents from infringement according to the national patent law.

Will Qipai products soon replace DIP? Time will give the answer. A simple truth is that a new electronic product will not be unfavorable to the market as long as it has an advantage in cost performance and there are no obstacles in production and application.