Tencent Digital (Wen Xin) According to the phoneArena website, although Microsoft has basically given up the Lumia brand, it will certainly not give up the production of smart phones. As previously reported by the media several times, Microsoft plans to release the Surface Phone phone next year.
The latest rumors about the Surface Phone come from Nokia Power User (a pretty reliable website). According to sources, Microsoft is currently developing two Surface Phone prototypes, one with 4GB of running memory and the other with 6GB of running memory. It is reported that the two Surface Phones are equipped with the new Qualcomm processing power of the new Xiaolong 835 processor - Samsung Galaxy S8 series phones planned to be released next year will also configure this processor. The 6GB model can run x86 software through the Continuum, but the 4GB model cannot.
phoneArena said, it is clear that the current Surface Phone prototype configuration about 5.5 inches Quad HD (1440 X 2560 pixels) display, may have "notebook accessories" - including similar to the Surface Pro and the keyboard cover and stylus. Of course, phoneArena cannot confirm this information yet.
By the end of next year, Microsoft will release up to three Surface Phones running Windows 10 Mobile Redstone 3. Redstone 3 is a larger and more important update package than Redstone 2 (the existing Windows 10 phone will be updated early next year).
Source: phoneArena
Via in Pad PCB
What is Via in Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.
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Storm Circuit Technology Ltd , https://www.stormpcb.com