From December 21st to 22nd, 2017, the 2017 High-Tech LED Annual Meeting and Golden Globe Awards Ceremony, hosted by Gaogong LED, took place in Shenzhen Baoan Dunxi Road. With the theme of “Deepening the Smoke and Softening the Strength, and Deep Integration to Tap New Opportunities,†the event brought together industry leaders and professionals from across the global LED sector.
As one of the most anticipated year-end events in the LED industry, the 2017 High-Tech LED Annual Meeting served as a platform for over 400 industry elites to discuss the latest trends in the market, technology, capital, and strategies. Attendees explored how deep integration can unlock new opportunities and drive innovation, while also addressing key challenges facing the industry.
On the morning of December 22nd, during the special session titled "LED Packaging Equipment and Materials: LED Packaging Equipment is Changing," Ye Shanghui, General Manager of Zhongke Core Source, delivered a keynote speech titled “Peace Evolution.†The session focused on the evolving landscape of LED packaging and its impact on high-power applications.
Ye Shanghui, General Manager of Zhongke Core Source
Over the years, LED devices have evolved from low-power to high-power applications, with COB (Chip-on-Board) becoming a dominant force in this transformation. While COB offers significant advantages, particularly in heat dissipation, it also presents unique challenges—especially when it comes to thermal management in high-power scenarios.
One of the main concerns in COB aging is the yellowing of silica gel, which affects light output and reliability. This issue is often linked to high temperatures, which can lead to cracking, especially in COB modules exceeding 100 watts.
According to Ye Shanghui, "In the early stages of core source packaging, we used copper substrates before transitioning to aluminum. Our material selection was based on thermal conductivity. Although copper has better thermal properties, aluminum allows for thinner layers. When we moved to ceramics, we found that our fluorescent materials bonded more stably. Instead of using aluminum nitride, we opted for alumina, enabling us to create a 300-watt COB light source in the same size. There’s a subtle difference in reflection, but overall, the temperature control is improved."
He further explained that when Zhongke Core Source transitioned from copper to aluminum substrates, they also switched from fluorescent rubber to insulating rubber. This change helped reduce thermal resistance, and through advanced processes, they achieved the same thickness with lower resistance.
Zhongke Core Source also utilized transparent fluorescent ceramics in their packaging design, creating an independent heat path. According to test results, the surface temperature of the fluorescent ceramic reached 121°C, but the critical Tc point was maintained at 65–70°C under normal operation, ensuring excellent reliability in real-world applications.
“We use transparent fluorescent ceramics to optimize the thermal structure of the light source package, effectively reducing the operating temperature of high-power COB light sources,†Ye concluded.
Ye Shanghui, General Manager of Zhongke Core Source
Over the years, LED devices have evolved from low-power to high-power applications, with COB (Chip-on-Board) becoming a dominant force in this transformation. While COB offers significant advantages, particularly in heat dissipation, it also presents unique challenges—especially when it comes to thermal management in high-power scenarios.
One of the main concerns in COB aging is the yellowing of silica gel, which affects light output and reliability. This issue is often linked to high temperatures, which can lead to cracking, especially in COB modules exceeding 100 watts.
According to Ye Shanghui, "In the early stages of core source packaging, we used copper substrates before transitioning to aluminum. Our material selection was based on thermal conductivity. Although copper has better thermal properties, aluminum allows for thinner layers. When we moved to ceramics, we found that our fluorescent materials bonded more stably. Instead of using aluminum nitride, we opted for alumina, enabling us to create a 300-watt COB light source in the same size. There’s a subtle difference in reflection, but overall, the temperature control is improved."
He further explained that when Zhongke Core Source transitioned from copper to aluminum substrates, they also switched from fluorescent rubber to insulating rubber. This change helped reduce thermal resistance, and through advanced processes, they achieved the same thickness with lower resistance.
Zhongke Core Source also utilized transparent fluorescent ceramics in their packaging design, creating an independent heat path. According to test results, the surface temperature of the fluorescent ceramic reached 121°C, but the critical Tc point was maintained at 65–70°C under normal operation, ensuring excellent reliability in real-world applications.
“We use transparent fluorescent ceramics to optimize the thermal structure of the light source package, effectively reducing the operating temperature of high-power COB light sources,†Ye concluded.
Cixi Xinke Electronic Technology Co., Ltd. , https://www.cxxinke.com