With the increasing functions of smartphones and the increasing demands of users for processing speed, and the advent of the era of 5G wireless communication and wireless charging, smartphone design developers will inevitably require processors with more powerful processing capabilities, which makes system design engineers Faced with increasing pressure on heat dissipation, because the quality of thermal management directly determines the performance improvement and service life of smartphones. How to solve the heat energy dissipation when the smartphone is fully functional and wireless charging has always been one of the focuses of the competition of R & D strength of various smartphone manufacturers.
The shipments of the smartphone industry, which is still growing rapidly, are expected to reach 2.1 billion units by 2022. Faced with this huge market demand, Dow Chemical, one of the world's top 500 companies, naturally cannot miss the opportunity. At the 2018 Asian Consumer Electronics Show in Shanghai, 
Taoxi â„¢ TC-3105 new silicone thermal gel is mainly coated on the ceramic or plastic package surface of the main heating chip in the smartphone, which is used to replace the traditional finished heat dissipation pad. The cost is similar to that of the heat dissipation pad, but the thermal conductivity gel can It is cured at room temperature or under self-heating of the chip, and the contact area formed after curing far exceeds the finished heat dissipation pad, thereby greatly improving the heat dissipation effect.
It is worth noting that Taoxi â„¢ TC-3105 silicone thermal gel can easily peel off the surface of the chip ceramic or plastic package without residue, greatly improving the maintenance efficiency, which is a major advantage for consumer electronic devices. As a printable or non-essential product, Taoxi â„¢ TC-3105 silicone thermal gel can also be integrated into an automated production process through a dispenser, without spending too much time on the finished thermal pad.
Rogier Reinders, Global Marketing Director, Circuit Board and System Assembly, Dow Consumer Products Solutions, said: "In response to the severe challenges of smartphone thermal management, major manufacturers and customers in China and around the world are looking for new solutions. Our latest development is successful The new silicone thermal conductive gel Taoxi â„¢ TC-3105 can provide excellent thermal management balance, facilitate customer repair and simplify processes. We expect this new material to set a new industry standard for thermal management, thus replacing the ones that affect design freedom Traditional bulky cooling pads. We have now partnered with a leading smartphone manufacturer to meet the heat dissipation requirements of future thinner, smaller and more compact consumer electronics devices. "
Taoxi â„¢ TC-3105 silicone thermal gel has low viscosity, good wettability, and low adhesion to epoxy resin and metal surfaces. It can be easily and completely peeled off during repair or maintenance.
Taoxi â„¢ TC-3105 thermal conductivity gel has a thermal conductivity of 2. When the thickness of the adhesive layer is less than 3mm, it will not collapse or crack during thermal aging. It can be used in smartphone components to achieve efficient thermal management.
CHLee, director of global technical service and development of circuit board and system assembly for the Dow Consumer Products Solutions business unit, said that Taoxi ™ TC-3105 silicone thermal gel can be processed in a variety of ways. He said: “First of all, the thermally conductive gel uses a one-component formula and does not need to be mixed. Second, the material can be cured at room temperature or cured by the chip ’s own heat, without a separate curing process, which helps improve production efficiency. Or, If the customer needs a faster curing speed, the material can be placed at a high temperature of 150 degrees. "
The new thermal conductive gel successfully developed by the Dow High-Performance Silicone Business Unit is promoted by the new brand Taoxi â„¢, which is based on the newly acquired Dow Corning Silicone Technology Platform and inherits 70 years of innovative experience and proven experience of the platform Performance.
High-Performance Silicones is a division of the Dow Consumer Solutions business unit that provides a range of performance-enhancing solutions to meet the diverse needs of customers and industries worldwide. From transportation, lighting, construction to chemical manufacturing, Dow's high-performance silicone business unit can help customers solve the most challenging heat dissipation problems.
Wuxi Doton Power , http://www.dotonpower.com