The battle between Intel and Broadcom in the Long Term Evolution (LTE) market is on the verge. Broadcom has completed all the procedures for the acquisition of Renesas Electronics' LTE assets in early October, and Intel has also officially announced the multi-band multi-mode LTE solution. Both will enter the European market in 2014 and actively expand their market share. And strive to explore the status of the LTE chip market.
Gartner Research Vice President Hong Cenwei pointed out that with the successive launch of LTE solutions and AP-integrated SoC solutions by various manufacturers, the competition for LTE chip vendors will become increasingly fierce next year.
Hong Cenwei, vice president of research at Gartner, said that 2014 can be regarded as a year for the LTE chip maker to officially start the battle. At that time, the market competition will not be like this year. Qualcomm (Qualcomm) will occupy more than 90% of the market, but will follow MediaTek , Broadcom, Intel and other manufacturers' products are released, forming a new situation of "one big, three small".
Gartner estimates that Qualcomm will still retain 80% to 90% of the market share next year, and MediaTek is expected to release a solution for the quad-core / octa-core application processor (AP) paired with the LTE baseband chip at the end of this year. After gaining a place in the mainland China market and the announcement of a system-on-chip (SoC) solution that integrates a baseband chip using a processor in the middle of next year, it further captured the LTE chip market.
As for Broadcom and Intel, they will scramble for the position. If MediaTek ’s current LTE solution is to enter the market outside of mainland China, it still needs to pass the verification procedure of the local telecommunications operator, which will take 6-9 months. In contrast, after Broadcom acquired Renesas ’LTE assets, it already has Through the dual-core LTE system single-chip solution in the North American, Japanese and European markets, and the supply chain relationship between Broadcom and Samsung is very stable, it is expected to stabilize the shipment volume of mobile devices exported to Europe by Samsung, boosting Broadcom in one fell swoop Market penetration of LTE solutions.
Nevertheless, Intel is not a fuel-efficient lamp. Intel ’s latest LTE solution, XMM 7160, has passed the interoperability tests between major infrastructure equipment manufacturers in Asia, Europe, and North America and first-tier telecom operators. Not only that, in order to accelerate the penetration rate of its LTE solution market, the company also Launched PCIe M.2 LTE module, which can add multi-mode (2G / 3G / LTE) data link function to various types of devices.
According to Intel's official information, the M.2 module is currently undergoing interoperability testing with first-line service providers around the world, and will soon be integrated into products launched by various manufacturers, including Huawei and Sierra Wireless. As well as Telit, these modules are expected to be built into tablets and ultrabooks (Ultrabooks) shipped by major global manufacturers in 2014, which shows that Intel ’s LTE solution market performance in 2014 There will be great gains.
Hong Cenwei pointed out that overall, global LTE chip shipments will double next year, and the competition among chip vendors will become more and more intense, but Qualcomm is still firmly in the market leader, and MediaTek benefits from China Mobile and other China The revenue of the mainland telecoms purchase case has been closely followed, and the battle for the competition between Broadcom and Intel will start from Europe.
TD-LTE chip market outlook Multi-mode requirements bring support to the market's previous average price
TD-LTE chip efficiency and type development, there are currently simple base frequency chip (Base Band; BB), simple radio frequency chip (Radio Frequency; RF), base frequency and radio frequency integrated chip, base frequency and application processor (ApplicaTIon Processor ;; AP) integrated system on a chip (SoC), software data (Soft Modem) type base frequency chip, etc., but the basic base frequency is the bulk of shipments.
Although the base frequency chips are the bulk of shipments, China Mobile will officially start commercial TD-LTE service in 2014. China Mobile has set out a five-mode ten-band TD-LTE chip requirement. Due to the high threshold, Most mainland chip companies cannot meet this requirement. Except for HiSilicon, a subsidiary of the Huawei Group, most of the companies that can meet the five-mode requirements are overseas companies outside the mainland, including Qualcomm and Marvell. , MediaTek (MTK), etc.
China Mobile is a bulk buyer, and overseas chip manufacturers outside the mainland are the majority of shipments, which will initially support the average price of the overall TD-LTE chip market. However, in the long run, the mainland chip industry will gradually strengthen the specifications and try to enter the market at a low price. The original owner will be forced to reduce the price in response, or move to a more integrated market development, such as the integration of baseband and application processors System-on-a-chip.
Global TD-LTE chip market estimate (excluding mobile phones and tablets)
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