The new automotive grade qualified SmartFusion®2 and IGLOO®2 devices are the industry's only devices that offer advanced safety and reliability that are critical to automotive applications. Microsemi Corpora TIon, a provider of differentiated semiconductor technology solutions for power, safety, reliability and performance, today announced the availability of new automotive grade field-programmable gate arrays (FPGAs) and system-on-chips (SoCs) ) FPGA device. Flash-based next-generation low-power FPGAs and ARM® Cortex®-M3 enabled SoC FPGA devices have achieved AEC-Q100 Level 2 certification, an industry standard that outlines electronic component standards to ensure that the final system meets automotive reliability levels. specification. The new automotive grade qualified SmartFusion®2 and IGLOO®2 devices are the industry's only devices that offer advanced safety and reliability that are critical to automotive applications.
Bruce Weyer, vice president and business unit manager at Microsemi, said: "Safety and reliability are key considerations for automotive applications that are designed to ensure their safety by avoiding tampering and cloning of customers' designs, data and hardware. The single event flip (SEU) immunity of these devices provides protection against neutron-induced firmware errors and helps customers achieve zero defect rates – a fundamental requirement in the automotive industry.
Microsemi's new flash-based automotive grade SoC and FPGA devices are based on the company's long-standing tradition of providing highly reliable devices with long-term product lifecycle support. The new device is the most suitable replacement for ASIC devices, providing low-power and cost-effective safe and reliable solutions for automotive applications, including advanced driver assistance systems (ADAS), vehicles to vehicles/vehicles to various items (V2V/V2X) ) Communication and electrical / hybrid engine control unit. In addition to the AEC-Q100 certification, Microsemi offers its customers SEU immunity, award-winning security features and a secure supply chain. The new devices target the fast-growing automotive electronics industry and the industry's growing demand for high reliability and security for zero-defect and tamper-free applications.
Colin Barnden, principal analyst at market research firm Semicast Research, commented: "The automotive semiconductor market is expected to rise from $29.4 billion in 2014 to $31.4 billion in 2015, an increase of nearly 7%. By comparison, we see 2015. The semiconductor market for vehicle connectivity and ADAS has grown by more than 20%. Microsemi's SmartFusion2 and IGLOO2 devices bring world-class security features to the automotive industry and will address the many systems system designers face in creating security systems for future connected cars. Challenges such as hacking, malicious tampering and data theft."
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