Molex, a global leader in complete interconnect solutions, has launched the NeoScaleâ„¢ parallel-panel interconnect system, designed to deliver superior signal integrity at data rates of 28 Gbps and beyond. This modular system is ideal for use in enterprise network towers, telecom switches, servers, industrial controllers, and high-speed medical or military scanning equipment. The NeoScale system features a patent-pending triad wafer design that isolates each differential pair, enabling optimal performance and customization.
Adam Stanczak, Molex’s new product development manager, explains, “The NeoScale triple layout consists of three pins: two signal pins and one shield ground pin, forming a dedicated 28 Gbps differential pair. This design eliminates the need for extra grounding pins and can be optimized for high-speed single-ended or power systems. The flexible and powerful NeoScale system offers a cleaner interface compared to Other connectors on the market, ensuring better signal transmission and integrity.â€
The system's cellular structure ensures minimal crosstalk and efficient PCB routing, helping reduce material costs. Its unique tombstone structure inside the connector housing protects the mating interface and flexible contacts, preventing damage to terminals. With a density of 82 differential pairs per square inch, the NeoScale supports high-speed differential pairs, single-ended signals, low-speed signals, and power contacts. It is available in 85 and 100 ohm impedance with mating stack heights ranging from 12 to 40mm. Design options include 6 to 30 circuit columns, with 2, 4, 6, or 8 row configurations, and a single component supporting up to 240 triple layouts.
NeoScale utilizes Molex’s patented Solder Charge Technology™ for PCB termination, offering a more cost-effective and reliable alternative to ball grid array mounting. This process simplifies design and ensures strong solder joints during mass production, eliminating the need for hot mounting or complex leadframe soldering.
The plug assembly has a differential pair spacing of 2.80mm, while the socket features directional and keying elements. The ground pin includes two SMT attachment points, and each triple layout has four solder charge connections. This ensures a consistent PCB footprint when mixing different types of differential pairs, high-speed single-ended, or power layouts within the same housing. NeoScale’s plug and socket orientation guides provide mirrored structures and back-to-back protection, enhancing signal integrity and mechanical stability.
Stanczak concluded, “The NeoScale system is the perfect solution for space-constrained designs and limited PCB areas, offering system architects and designers a durable, customizable tool for high-density applications.â€
Electronic Equipment Shielding, EMI Shield for Electronics, Electronic Device Protection
Wenzhou Hesheng Electronic Co., Ltd. , https://www.heshengelec.com